US Patent Issued to SK hynix on April 14 for "Stack packages and methods of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,784, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Stack packages and methods of manufacturing the same" was invented by Ki Jun Sung (Icheon-si, South Korea) and Chae Sung Lee (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack package, and a method of manufacturing the same, includes a first encapsulant layer formed on a carrier. Also semiconductor dies are sequentially offset stacked on the first encapsulant layer. Vertical connectors connected to the semiconductor dies are formed. A second encapsulant layer coupled to the first encapsulant layer is formed to encapsulate the vertical conne...