US Patent Issued to SJ Semiconductor(Jiangyin) on Oct. 6 for "Packaging structure having organic interposer layer and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,749, issued on Oct. 6, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China).

"Packaging structure having organic interposer layer and method for manufacturing same" was invented by Chengchung Lin (Jiangyin City, China) and Yenheng Chen (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure having an organic interposer layer and a method for manufacturing the same are provided; the method comprises: forming a rewiring layer having metal wiring layers and inorganic dielectric layers over a semiconductor substrate; forming conductive pillars over the rewiring layer, and electrically connected to the...