US Patent Issued to SJ Semiconductor(Jiangyin) on Aug. 4 for "Fan-out system-level packaging structure and packaging method" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,079, issued on Aug. 4, was assigned to SJ Semiconductor(Jiangyin) Corp. (JiangSu, China).

"Fan-out system-level packaging structure and packaging method" was invented by Yenheng Chen (Jiangyin City, China) and Chengchung Lin (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a fan-out system-level package and structure are disclosed. The method comprises: forming a first rewiring layer over a supporting substrate; electrically connecting a connecting bridge to the first rewiring layer; forming an encapsulation layer over the first rewiring layer and the connecting bridge; forming a second rewiring layer over ...