US Patent Issued to SJ Semiconductor(Jiangyin) on Aug. 25 for "Thermally conductive semiconductor packaging structure and method for preparing same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,161, issued on Aug. 25, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China).

"Thermally conductive semiconductor packaging structure and method for preparing same" was invented by Yenheng Chen (Jiangyin City, China) and Chengchung Lin (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive semiconductor packaging structure includes a cooling component exposed on one surface and an electrical interconnecting component on the other surface. The cooling component has a thermally conductive die, its back side is provided with thermally conductive members extending away from the back side, and a fro...