US Patent Issued to SJ Semiconductor(Jiangyin) on Aug. 18 for "Fan-out wafer-level packaging structure and method for manufacturing same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,968, issued on Aug. 18, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China).

"Fan-out wafer-level packaging structure and method for manufacturing same" was invented by Chengchung Lin (Jiangyin City, China) and Jin Yang (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out wafer-level packaging structure and a method for manufacturing it are disclosed. The structure includes: a rewiring layer, a chip, an electrical component, a protective layer made of UV-curable adhesive, a molding layer, and a solder ball. The protective layer is disposed on surfaces of the electrical component, sealing the electrical c...