US Patent Issued to SJ Semiconductor(Jiangyin) on April 21 for "Fan-out stacked semiconductor package structure and packaging method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,868, issued on April 21, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China).

"Fan-out stacked semiconductor package structure and packaging method thereof" was invented by Yenheng Chen (Jiangyin City, China) and Chengchung Lin (Jiangyin City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out stacked semiconductor package structure and a packaging method thereof are disclosed. The structure includes a three-dimensional memory chip package unit and a two-dimensional fan-out peripheral circuit chip SiP package unit. The three-dimensional memory chip package unit includes: at least two memory chips laminated in a stepp...