US Patent Issued to Singapore University Of Technology And Design on July 21 for "Gripping apparatus, method of forming the gripping apparatus and method of operating thereof" (Singaporean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,137, issued on July 21, was assigned to Singapore University Of Technology And Design (Singapore).

"Gripping apparatus, method of forming the gripping apparatus and method of operating thereof" was invented by Pablo Valdivia Y Alvarado (Singapore), Snehal Jain (Singapore) and Vignesh Subramaniam (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A gripping apparatus includes a palm member; a plurality of finger members configured to couple to the palm member, each of the plurality of finger members comprising a plurality of phalange members arranged in series along a longitudinal axis of the finger member, each phalange member being formed of...