US Patent Issued to SILICONWARE PRECISION INDUSTRIES on June 30 for "Electronic package having a chip with a trench in the surface" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,553, issued on June 30, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Electronic package having a chip with a trench in the surface" was invented by Che-Yu Lee (Taichung City, Taiwan), Chi-Ching Ho (Taichung City, Taiwan), Chao-Chiang Pu (Taichung City, Taiwan), Yi-Min Fu (Taichung City, Taiwan) and Po-Yuan Su (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a manufacturing method thereof are provided, in which a full-panel wafer is provided and includes a plurality of electronic bodies arranged in an array at intervals, a plurality of trenches are formed across the...