US Patent Issued to SILICONWARE PRECISION INDUSTRIES on June 30 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,547, issued on June 30, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Chih-Hsien Chiu (Taichung City, Taiwan), Wen-Jung Tsai (Taichung City, Taiwan), Chien-Cheng Lin (Taichung City, Taiwan), Ko-Wei Chang (Taichung City, Taiwan), Yu-Wei Yeh (Taichung City, Taiwan), Shun-Yu Chien (Taichung City, Taiwan) and Chia-Yang Chen (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that...