US Patent Issued to SILICONWARE PRECISION INDUSTRIES on June 2 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,646,826, issued on June 2, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan).

"Electronic package and manufacturing method thereof" was invented by Yi-Chun Lai (Taichung, Taiwan), Hsuan-Jen Wang (Taichung, Taiwan) and Rung-Jeng Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, and an antenna structure is stacked on the carrier structure via conductors, where at least one through hole is formed on and penetrating through the antenna structure, and an insulating support body ...