US Patent Issued to SILICONWARE PRECISION INDUSTRIES on April 21 for "Working system for semiconductor packaging process and operation method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,779, issued on April 21, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Working system for semiconductor packaging process and operation method thereof" was invented by Tang-Hsin Kuo (Taichung City, Taiwan), Chin-Chih Hsiao (Taichung City, Taiwan), Hung-Wen Chien (Taichung City, Taiwan) and I Hsu (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return...