US Patent Issued to SILICON BOX on July 28 for "Method of manufacturing fan-out packaging device and fan-out packaging device manufactured thereby" (Nevada Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,820, issued on July 28, was assigned to SILICON BOX PTE. LTD. (Singapore).

"Method of manufacturing fan-out packaging device and fan-out packaging device manufactured thereby" was invented by Sehat Sutardja (Las Vegas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of manufacturing a fan-out packaging device using wafer or panel level packaging including forming a base metal layer on a partial area of a fan-out packaging substrate, forming a first dielectric layer on the base metal layer, patterning the first dielectric layer to form a via hole, forming a redistribution layer (RDL) on the first dielectric layer and the via hole,...