US Patent Issued to SIKA TECHNOLOGY on Oct. 20 for "One-component thermosetting epoxy composition with improved adhesion" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,767,792, issued on Oct. 20, was assigned to SIKA TECHNOLOGY AG (Baar, Switzerland).

"One-component thermosetting epoxy composition with improved adhesion" was invented by Shunsuke Yamada (Chigasaki, Japan) and Satoshi Urayama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have i...