ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,731, issued on Oct. 6, was assigned to Siemens AG (Munich).
"Arrangement for cooling and motor module" was invented by Lutz Namyslo (Hausen, Germany), Thomas Schwinn (Herzogenaurach, Germany) and Roman Kogler (Nuremberg, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "An arrangement for cooling semiconductor components includes a cooling body base with a component side and a structural element side opposite the component side, wherein the semiconductor components are arrangeable in succession in the flow direction of a cooling medium, the structural element side are configured to increase its surface area by structural elements, and the struct...