US Patent Issued to Siemens on July 28 for "Power semiconductor module comprising at least one power semiconductor element" (German Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,762, issued on July 28, was assigned to Siemens AG (Munich).

"Power semiconductor module comprising at least one power semiconductor element" was invented by Christian Raduge (Nuremberg, Germany), Claus Florian Wagner (Nuremberg, Germany) and Michael Woiton (Nuremberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module includes a power semiconductor element. In order to reduce the required installation space of the power semiconductor module and to increase the service of the power semiconductor module, the power semiconductor element is connected in an electrically insulating and thermally conductive manner to a coo...