ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,176, issued on July 21, was assigned to Siemens AG (Munich).
"Power module having at least one power unit" was invented by Roman Kogler (Nuremberg, Germany), Alexander Luft (Nuremberg, Germany), Bernd Roppelt (Unterhald, Germany), Jens Schmenger (Forchheim, Germany) and Thomas Schwinn (Herzogenaurach, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a power unit. The power unit includes a power semiconductor and a substrate. In order to improve the reliability of the power module, the substrate of the power unit is directly connected in an integrally bonded manner to a surface of a heat sink. The power unit is surrounde...