US Patent Issued to Siemens on Aug. 11 for "Cooling device for cooling a semiconductor module and converter with the cooling device" (German Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,597, issued on Aug. 11, was assigned to Siemens AG (Munich).

"Cooling device for cooling a semiconductor module and converter with the cooling device" was invented by Benno Weis (Hemhofen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling apparatus includes a semiconductor module having first and second cover faces, with the first cover face facing away from the second cover face, a module space between the first and second cover faces, and side faces to enclose the module space. A heat sink cools the semiconductor module and includes a base body. Cooling elements project from a first face of the base body and a cooling medium flows a...