ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,240, issued on Aug. 4, was assigned to Sicily Merger Sub II Inc. (Santa Clara, Calif.).
"Optically bridged multicomponent package with extended temperature range" was invented by Philip Winterbottom (San Jose, Calif.), David Lazovsky (Los Gatos, Calif.), Ankur Aggarwal (Pleasanton, Calif.), Martinus Bos (San Jose, Calif.) and Subal Sahni (La Jolla, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is incl...