US Patent Issued to Sicily Merger Sub II on Aug. 11 for "Optical multi-chip interconnect bridge architecture and fabrication processes" (California, Arizona Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,704,678, issued on Aug. 11, was assigned to Sicily Merger Sub II Inc. (Santa Clara, Calif.).

"Optical multi-chip interconnect bridge architecture and fabrication processes" was invented by Ankur Aggarwal (Pleasanton, Calif.), Suresh Venkata Pothukuchi (Chandler, Ariz.) and Subal Sahni (La Jolla, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "System in package (SiP) architectures using stitched reticle photonic integrated circuits (PICs), including a multi-die interconnect bridge (OMIB), are disclosed along with corresponding fabrication processes. A stitched multi-reticle OMIB provides an optically-enabled bridge between semiconductor dies referr...