US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Nov. 3 for "Terminal structure and wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,897, issued on Nov. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Terminal structure and wiring substrate" was invented by Junichi Nakamura (Nagano, Japan), Tomoya Kitamura (Nagano, Japan) and Yoko Nakabayashi (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A terminal structure includes a first wiring layer, an insulation layer covering the first wiring layer, an opening extending through the insulation layer, via wiring formed in the opening, a second wiring layer electrically connected to the via wiring on the insulation layer, a protective metal layer formed on the second wiring layer, a solder layer formed...