ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,534, issued on March 24, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Density distribution of conductive bumps on wafer" was invented by Kengo Yamamoto (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer includes a substrate and conductive bumps on a surface of the substrate. In a plan view from a direction perpendicular to the surface of the substrate, the area density of the conductive bumps is higher in a first area than in a second area around the first area in the surface of the substrate. The first area has effective chip areas arranged therein."
The patent was filed on Aug. 2, 2022, under Applicati...