ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,905, issued on March 17, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Masahiro Sunohara (Nagano, Japan), Keita Sato (Nagano, Japan), Hiroharu Yanagisawa (Nagano, Japan) and Riku Nishikawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes a base plate having a first surface in which a plurality of first bottomed holes are formed, an electrostatic chuck mounted on the first surface of the base plate and having a second surface facing the first surface, the second surface being formed therein with a plurality of second bottomed holes each c...