ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,973, issued on March 17, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Semiconductor device" was invented by Kei Murayama (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lower substrate, a semiconductor element mounted on an upper surface of the lower substrate, an upper substrate disposed on an upper surface of the semiconductor element, one or more through holes extending through the upper substrate in a thickness-wise direction, an encapsulation resin disposed between the lower substrate and the upper substrate and encapsulating the semiconductor element, a wiring layer disp...