US Patent Issued to SHINKO ELECTRIC INDUSTRIES on March 17 for "Lead frame, semiconductor device, and lead frame manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,964, issued on March 17, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Lead frame, semiconductor device, and lead frame manufacturing method" was invented by Jun Izuoka (Nagano, Japan) and Koichi Ishida (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame includes a support portion that has one end on which a first part and a second part that has a smaller thickness than the first part are arranged, a lead, and a heat sink that is welded to the support portion in the second part. A method of manufacturing the lead frame includes forming, from a metal plate, a frame member that includes a support portion...