US Patent Issued to SHINKO ELECTRIC INDUSTRIES on July 28 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,391, issued on July 28, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Wiring board" was invented by Takashi Nishiyama (Nagano, Japan), Tomoo Yamasaki (Nagano, Japan) and Noriyoshi Shimizu (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first insulating layer provided on an interconnect layer, a second insulating layer provided on the first insulating layer, a first opening formed in the first insulating layer and reaching the interconnect layer, a second opening formed in the second insulating layer and having a lower end connected to an upper end of the first opening, a third opening f...