ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,465, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Hiroshi Yokota (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an insulating layer, first and second pads provided on the insulating layer and including a first surface in contact with the insulating layer, a second surface opposite to the first surface, and a side surface connecting the first and second surfaces, respectively, and a protective insulating layer provided above the insulating layer. The first and second pads have a portion exposed inside an opening in the protective insulat...