US Patent Issued to SHINKO ELECTRIC INDUSTRIES on April 14 for "Method of making an interconnect substrate" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,395, issued on April 14, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Method of making an interconnect substrate" was invented by Yuji Yukiiri (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desme...