US Patent Issued to SHINKO ELECTRIC INDUSTRIES, SHINSHU UNIVERSITY on April 21 for "Connection structural body with Cu-Cu bonding and roughened surface deposits" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,874, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan) and SHINSHU UNIVERSITY (Matsumoto City, Japan).

"Connection structural body with Cu-Cu bonding and roughened surface deposits" was invented by Mitsuhiro Aizawa (Nagano, Japan) and Susumu Arai (Nagano City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connection structural body includes: a first connection terminal including a first opposing surface; a first roughened-surface copper metal film formed on the first opposing surface; a second connection terminal including a second opposing surface facing the first opposing surface; and a second roughe...