US Patent Issued to SHINDENGEN ELECTRIC MANUFACTURING on Oct. 6 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,769, issued on Oct. 6, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo).

"Semiconductor module" was invented by Yuji Morinaga (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor module that includes four semiconductor chips Q1 to Q4, four wiring patterns, first and second power source terminals and first and second intermediate point terminals thus forming a bridge circuit in the semiconductor. The bridge circuit is formed where the chip Q1 and the chip Q3 are disposed on a high side and the chip Q2 and the chip Q4 are disposed on a low side. In a recessed portion that is formed in the wiring pattern, a...