US Patent Issued to SHIN-ETSU HANDOTAI on March 17 for "Single-side polishing apparatus, single-side polishing method, and polishing pad" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,473, issued on March 17, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).

"Single-side polishing apparatus, single-side polishing method, and polishing pad" was invented by Junichi Ueno (Shirakawa, Japan) and Kaoru Ishii (Shirakawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A single-side polishing apparatus including: a base turntable having a groove for vacuum suction; a detachable polishing turntable immobilized by vacuum suction; a polishing pad; and a polishing head configured to hold a wafer. The single-side polishing apparatus brings a surface of a wafer held by the polishing head into sliding contact with the polishing pad for...