ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,426, issued on Sept. 1, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).
"Microstructure-transfer stamp component" was invented by Hideo Nakagawa (Omihachiman, Japan), Yoshinori Ogawa (Kamakura, Japan) and Toshiyuki Ozai (Takasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A microstructure-transfer stamp component including a substrate and a silicone-based rubber film formed on the substrate, wherein a surface of the silicone-based rubber film facing away from the substrate has one or more recesses each being closed except for a surface opening. This provides a microstructure-transfer stamp component that can optimize temporary adhesi...