US Patent Issued to SHIN-ETSU CHEMICAL on March 24 for "Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,973, issued on March 24, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component" was invented by Hiroyuki Urano (Joetsu, Japan), Masashi Iio (Joetsu, Japan) and Katsuya Takemura (Joetsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polymer in the present invention contains a structural unit represented by the following general formula (1), where X1 is a tetravalent organic group, Z1 is a divalent organic ...