US Patent Issued to SHIN-ETSU CHEMICAL on March 24 for "Adhesive composition and film-shaped sealing material" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,050, issued on March 24, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Adhesive composition and film-shaped sealing material" was invented by Takayuki Kusunoki (Annaka, Japan), Masao Ando (Joetsu, Japan), Nobuhiro Ichiroku (Annaka, Japan), Hideo Nakagawa (Omihachiman, Japan), Atsushi Wakamiya (Kyoto, Japan) and Yuko Matsushige (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive composition, including: a reaction product (A) among a bifunctional epoxy resin represented by the formula (2), a tri- or more functional epoxy resin represented by the formula (3), and a saturated acid anhydride represented by the following gene...