US Patent Issued to SHIN-ETSU CHEMICAL on June 2 for "Method for dismantling bonded member, bonded member, and easily dismantled silicone-based liquid adhesive" (Japanese Inventor)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,020, issued on June 2, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Method for dismantling bonded member, bonded member, and easily dismantled silicone-based liquid adhesive" was invented by Norio Kameda (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "With regard to a bonded member in which a plurality of members are bonded together by a cured product obtained by curing a curable silicone-based liquid adhesive containing a hydroxide compound with a decomposition temperature of 180deg C.-600deg C. and a specific amount of particles which generate heat by means of microwaves, a dismantling method for the bonded member including a...