US Patent Issued to SHIN-ETSU CHEMICAL on July 14 for "Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,086, issued on July 14, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing" was invented by Tamotsu Oowada (Yokohama, Japan), Shohei Tagami (Annaka, Japan), Mitsuo Muto (Takasaki, Japan) and Masahito Tanabe (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an o...