US Patent Issued to SHIBAURA MECHATRONICS on July 21 for "Substrate treatment apparatus and processing method of substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,037, issued on July 21, was assigned to SHIBAURA MECHATRONICS Corp. (Kanagawa, Japan).

"Substrate treatment apparatus and processing method of substrate" was invented by Satoshi Nakamura (Kanagawa, Japan), Kensuke Demura (Kanagawa, Japan) and Masaya Kamiya (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment a substrate treatment apparatus removes foreign matter from a surface of a substrate by forming a frozen film at the surface of the substrate, incorporating, into the frozen film, the foreign matter adhered to the surface of the substrate, and thawing the frozen film including the foreign matter. A liquid s...