US Patent Issued to SHENZHEN UNIVERSITY, SHENZHEN WIVISION TECHNOLOGY on March 31 for "Method and apparatus for deformation measurement, electronic device, and storage medium" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,995, issued on March 31, was assigned to SHENZHEN UNIVERSITY (Shenzhen, China) and SHENZHEN WIVISION TECHNOLOGY Co. LTD. (Shenzhen, China).

"Method and apparatus for deformation measurement, electronic device, and storage medium" was invented by Yihe Yin (Shenzhen Guangdong, China), Qifeng Yu (Shenzhen Guangdong, China), Xiaolin Liu (Shenzhen Guangdong, China), Yueqiang Zhang (Shenzhen Guangdong, China) and Biao Hu (Shenzhen Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for deformation measurement is provided. When the mobile platform moves to a first monitoring position in an area to-be-measured, a first image is obtaine...