ALEXANDRIA, Va., April 21 -- United States Patent no. D1,122,908, issued on April 21, was assigned to Shenzhen Siweier Technology Co. Ltd (Shenzhen, China).
"Bone conduction earphone" was invented by Binglan Tang (Ganzhou, China).
The patent was filed on March 28, 2025, under Application No. D/995,775.
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