US Patent Issued to SHENZHEN LOPIE SOPHISTICATED INDUSTRY on Aug. 4 for "Cover for earphone case or the like" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. D1,138,141, issued on Aug. 4, was assigned to SHENZHEN LOPIE SOPHISTICATED INDUSTRY Co. LTD (Shenzhen, China).

"Cover for earphone case or the like" was invented by Jianjun Wang (Shenzhen, China).

The patent was filed on Sept. 2, 2022, under Application No. D/852,002.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1138141&OS=D1138141&RS=D1138141

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