US Patent Issued to SHENZHEN JUFEI OPTOELECTRONICS on April 7 for "LED chip module and method for manufacturing LED chip module" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,039, issued on April 7, was assigned to SHENZHEN JUFEI OPTOELECTRONICS Co. LTD (Shenzhen, China).

"LED chip module and method for manufacturing LED chip module" was invented by Yong Liu (Shenzhen, China), Yanming Chen (Shenzhen, China), Pingru Sun (Shenzhen, China), Meizheng Xing (Shenzhen, China) and Hongbo Su (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flip LED chip module and a method for manufacturing LED chip module are provided. In the manufactured flip LED chip module, the second glue layer for reducing light energy is formed on the front surface of each of the flip LED chips. Therefore, the difference between the light ...