US Patent Issued to Shenzhen Hingin Technology on July 14 for "Enclosure" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. D1,134,254, issued on July 14, was assigned to Shenzhen Hingin Technology Co. Ltd. (Shenzhen, China).

"Enclosure" was invented by Zeqin Yang (Shenzhen, China), Ping Zhu (Shenzhen, China) and Penghui Wei (Shenzhen, China).

The patent was filed on June 3, 2025, under Application No. D/006,662.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1134254&OS=D1134254&RS=D1134254

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