US Patent Issued to SHENNAN CIRCUITS on March 3 for "Inductor assembly and manufacturing method for inductor assembly" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,586, issued on March 3, was assigned to SHENNAN CIRCUITS Co. LTD. (Shenzhen, China).

"Inductor assembly and manufacturing method for inductor assembly" was invented by Lixiang Huang (Shenzhen, China), Zedong Wang (Shenzhen, China) and Hua Miao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inductor assembly and a manufacturing method for an inductor assembly are provided. The inductor assembly includes a circuit board, a magnetic component, and a winding wire. The circuit board defines a groove body, the magnetic component is embedded in the groove body, and the winding wire is arranged on the magnetic component, surrounds along ...