US Patent Issued to SHENGYI TECHNOLOGY on Sept. 15 for "Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising same" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,553, issued on Sept. 15, was assigned to SHENGYI TECHNOLOGY Co. LTD. (Guangdong, China).

"Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising same" was invented by Weifeng Yin (Guangdong, China), Qianfa Liu (Guangdong, China), Jianying Shi (Guangdong, China), Jiangling Zhang (Guangdong, China), Sha Li (Guangdong, China), Songgang Chai (Guangdong, China), Yongjing Xu (Guangdong, China) and Cui Huo (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a res...