ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,767,775, issued on Oct. 20, was assigned to SHENGYI TECHNOLOGY Co. LTD. (Dongguan, China).
"Thermosetting resin composition and application thereof" was invented by Cheng Luo (Dongguan, China), Yundong Meng (Dongguan, China) and Shanyin Yan (Dongguan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substitute...