US Patent Issued to Shengtak New Materials on April 14 for "Method for preparing stainless steel seamless tube with ultra-high cleanliness for integrated circuit and IC industry preparation device, and stainless steel seamless tube" (Chinese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,026, issued on April 14, was assigned to Shengtak New Materials Co. Ltd (Changzhou, China).

"Method for preparing stainless steel seamless tube with ultra-high cleanliness for integrated circuit and IC industry preparation device, and stainless steel seamless tube" was invented by Hong Gao (Changzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention discloses a method for preparing a stainless steel seamless tube with ultra-high cleanliness for an integrated circuit and an IC industry preparation device, and a stainless steel seamless tube with ultra-high cleanliness. The stainless steel seamless tube which comprises, by mass, Cle...