US Patent Issued to Shanghai Zhonglei New Material Science on Sept. 8 for "Nanoscale polyamide composite material, and preparation method therefor and use thereof" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,304, issued on Sept. 8, was assigned to Shanghai Zhonglei New Material Science Co. Ltd. (Shanghai).

"Nanoscale polyamide composite material, and preparation method therefor and use thereof" was invented by Chunyan Liu (Shanghai) and Boen Liu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A nanoscale polyamide composite material, and a preparation method therefor and the use thereof. The nanoscale polyamide composite material comprises 60-95 parts by weight of a polyamide resin, 10-20 parts by weight of polyphenylene sulfide, 2-10 parts by weight of a nanoclay, and 1-2 parts by weight of nano titanium dioxide. The polyphenylene sulfide, the...