US Patent Issued to SHANGHAI XIANFANG SEMICONDUCTOR, NATIONAL CENTER FOR ADVANCED PACKAGING on April 21 for "Wafer-level chip structure, multiple-chip stacked and interconnected structure and fabricating method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,826, issued on April 21, was assigned to SHANGHAI XIANFANG SEMICONDUCTOR Co. LTD. (Shanghai) and NATIONAL CENTER FOR ADVANCED PACKAGING Co. LTD. (Wuxi, China).

"Wafer-level chip structure, multiple-chip stacked and interconnected structure and fabricating method thereof" was invented by Liqiang Cao (Wuxi, China), Yangyang Yan (Wuxi, China), Peng Sun (Wuxi, China), Tianfang Chen (Wuxi, China) and Fengwei Dai (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer-level chip structure, a multiple-chip stacked and interconnected structure and a fabricating method thereof, wherein the wafer-level chip structure includes: a through-silicon v...