US Patent Issued to SHANGHAI HUZHENG INDUSTRY on April 14 for "Organic-inorganic composite thermal insulation medium and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,868, issued on April 14, was assigned to SHANGHAI HUZHENG INDUSTRY Co. LTD (Shanghai).

"Organic-inorganic composite thermal insulation medium and preparation method thereof" was invented by Jiayi Li (Shanghai) and Jiaxiao Xue (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is an organic-inorganic composite thermal insulation medium, which is a nanoparticle having a structure of (Mx-Rn)WOy, where M represents a doped metal element, R represents an organic complex group, 0.3less than equal toxless than equal to0.7, 2greater thanygreater than4, n represents a polymerization degree of the organic complex group, and nless than=10; M i...