US Patent Issued to Shanghai Huali Microelectronics on April 7 for "Method for analyzing layout pattern density" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,942, issued on April 7, was assigned to Shanghai Huali Microelectronics Corp. (Shanghai).

"Method for analyzing layout pattern density" was invented by Wei Cheng (Shanghai), Zhonghua Zhu (Shanghai) and Fang Wei (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application discloses a method for analyzing a layout pattern density, comprising: step 1, providing layouts of a chip, and merging the layouts to form a wafer level layout, wherein the wafer level layout presents a first circle in a top view, and the layout comprises a plurality of mask layers; step 2, segmenting the first circle to form a plurality of check windows; step 3...