US Patent Issued to Shanghai Glorysoft on March 3 for "Yield rate prediction method in manufacture of integrated circuit wafer" (Chinese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,902, issued on March 3, was assigned to Shanghai Glorysoft Co. Ltd (Shanghai).

"Yield rate prediction method in manufacture of integrated circuit wafer" was invented by Weitang Shi (Shanghai), Wenrui Wang (Shanghai), Ziming Ceng (Shanghai) and Yue Cao (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a yield rate prediction method for manufacture of integrated circuit wafers, which includes the following steps: obtaining candidate reference product models; obtaining parameters of the candidate reference products; obtaining functions of candidate reference products; predicting candidate reference products; selecting a fi...